专利内容由知识产权出版社提供
专利名称：METHOD OF FORMING AN ELECTRONIC
DEVICE INCLUDING REMOVING ADIFFERENTIAL ETCH LAYER
发明人：MATHEW, Leo,JAWARANI, Dharmesh申请号：EP09743596.0申请日：20090506公开号：EP22094A2公开日：20110302
摘要：A method of forming an electronic device can include forming a metallic layerover a side of a workpiece including a substrate, a differential etch layer, and a
semiconductor layer. The differential etch layer may lie between the substrate and thesemiconductor layer, and the semiconductor layer may lie along the side of the
workpiece. The process can further include selectively removing at least a majority of thedifferential etch layer from between the substrate and the semiconductor layer, andseparating the semiconductor layer and the metallic layer from the substrate. Theselective removal can be performed using a wet etching, dry etching, or electrochemicaltechnique. In a particular embodiment, the same plating bath may be used for plating themetallic layer and selectively removing the differential etch layer.
申请人：Astrowatt, Inc.
地址：16900 Willow Oak Lane Round Rock, TX 78681 US
国籍：US
代理机构：Zimmermann & Partner
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